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About the Matyjaszewski Group
Center for Macromolecular Engineering
CRP Consortium
ATRP Consortium
(19962000)
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Alper Nese
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B.S. Chemistry
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Areas of Concentration: Polymer Characterization, Biochemistry, Hydrogel Preperation
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Bogazici University, Istanbul, Turkey |
Sept. 2006
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M.S. Chemistry |
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Areas of Concentration: Nanocomposite Preperation, Polymer Synthesis |
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RESEARCH INTERESTS
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Hydrogel Preperation by Gamma-irradiation |
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Nanocomposite Preperation by Photopolymerization |
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Molecular Brushes |
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Imagination and Realization of Macromolecular Materials |
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EXPERIENCE |
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Secretary, ACS, Polymer Division, Pittsburgh Section |
May 2008Present |
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Chemistry Department Representative, Graduate Student Assembly (GSA) |
20072008 |
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Graduate Student, Carnegie Mellon University, Department of Chemistry |
Aug. 2006Present |
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- IT Manager (Computers, WEB, Server)
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AWARDS
AFFILIATIONS
PRESENTATIONS
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8th International Symposium, Polymers for Advanced Technologies, Budapest, Hungary 13-16 September 2005.
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PUBLICATIONS
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Insun Park, Alper Nese, Krzysztof Matyjaszewski, and Sergei S. Sheiko, Molecular Tweezers: Controlled Scission of a Single Disulfide Bond by Adsorption-Induced Tension in Brush-like Macromolecules Submitted. |
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Hyung-il Lee, Jamie R. Boyce, Alper Nese, Sergei S. Sheiko, and Krzysztof Matyjaszewski, pH-Induced Conformational Changes of Loosely-Grafted Molecular Brushes Containing Poly (acrylic acid) Side Chains Polymer. 2008, in press. |
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Metin Sitti, Brian Cusick, Burak Aksak, Alper Nese, Hyung-il Lee, Hongchen Dong, Tomasz Kowalewski, and Krzysztof Matyjaszewski. Polymer Molecular Brushes as Biologically Inspired Reversible Fibrillar Adhesives Submitted.
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Alper Nese, Sinan Sen, Mehmet Atilla Tasdelen, Nihan Nugay, Yusuf Yagci. Clay-PMMA Nanocomposites by Photoinitiated Radical Polymerization Using Intercalated Phenacyl Pyridinium Salt Initiators Macromol. Chem. Phys. 2006, 207, 820 - 826.
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PATENTS
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Burak Aksak, Brian Cusick, Hyung-il Lee, Alper Nese, Tomasz Kowalewski, Metin Sitti, and Krzysztof Matyjaszewski "Rate Sensitive Dry Adhesive patent application submitted. |
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